初稿截稿日期：2019-07-24

1. High-Speed and Broadband Wireless Technologies
• Broadband Fixed Wireless and Last-Mile Access
• Ultra-High Data Rate Communications Links - Powerline
Communication Technologies
• 3G/4G/5G Wireless Communication Services
• Ultra-Wideband (UWB) Systems
• Optical Networks and Systems
2. Emerging Wireless Technologies and Applications
• M2M & V2V Technologies & Applications
• Resource Management, Security
• Femtocell and Heterogeneous Networks
• Green, Sustainable Wireless Tech. & Networks
3. Wireless System Architecture and Modeling
• Ad Hoc Network Techniques for Internetworking
• Distributed Network Architectures and Systems
• Wireless Mesh and Broadband Local/Personal/ Body Area
Networks
• Wireless Security and RFID Technologies
4. Propagation/Channel Modeling and Utilization
• Propagation/Channel Characterization & Modeling -
Fading Countermeasures
• Spectrum Sensing Technologies
• Frequency and Channel Allocation Algorithms
5. Digital Signal Processing, SDR, & Cognitive
Radio
• Digital/Analog Adaptive/Collaborative Signal Processing
• Methods for Signal Integrity and Signal Conditioning
• Interference Mitigation and Cancellation Techniques
• Software/Hardware architectures, Algorithms
• MAC, Networking protocols, Policies, Standardization
• Dynamic Spectrum Sharing, Coexistence, Interoperability
6. Applications to Bio-medical, Environmental,
and Internet of Things
• Miniaturization and Integration of Wireless Technologies
• Personal Area Networks and Body area Sensor
Networks
• Wireless Positioning Technologies & Remote Sensing
7. MIMO and Multi-Antenna Communications
• MIMO, MU-MIMO, Space-Time Processing - Relaying
Technologies
• Cooperative/Collaborative Technology
• Multi-Beam Smart Antennas
8. Antenna Technologies
• Passive & Active Antennas from RF to THz Frequencies
• Miniaturized, Multi-frequency and Broadband Antennas
• Wireless Platform Integrated Antennas
9. Transceiver & Front-end Technologies,
SOC & SiP
• Receiver, Transmitter and Transceiver Components -
Active Circuits and Sub-systems
• Multi-Standard Circuits and Sub-systems
• Low-Power/Low Noise RF/Analog IC and SoC-Chip
• Highly Integrated Transceivers for Sensing and Imaging
10. Passive Components & Packaging
• Discrete, Embedded and Distributed Passive
Components, Filters, Couplers and Signal Separation
Devices
• Discrete and Highly Integrated Packaging
• 3D-Packaging, Interconnects, and Applications
• Packaging of MEMs, Biosensors, Organic ICs, etc.
11. MM-Wave to THz Technology & Applications
• Device and Circuit Concept & Demonstration
• Unique Receivers and Transmitters - Integrated Circuits
• Wireless Links, Arrays & Applications
12. 3D & Novel Engineered Materials
• Additive 3D Manufacturing for Wireless Applications
• Novel Engineered Materials for Antenna, Packaging