2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)
时间:2020-10-05 09:00 至 2020-10-07 18:00
地点:Salt Lake City
- 会议内容
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2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC) 已过期
会议时间:2020-10-05 09:00至 2020-10-07 18:00结束 会议地点: Salt Lake City 详细地址会前通知 None 会议规模:暂无 主办单位: IEEE Council on Electronic Design Automation IEEE Circuits and Systems Society IFIP WG10.5 |
会议内容
VLSI-SoC 2018 is the 26thin a series of international conferences sponsored by the International Federation for Information Processing Technical Committee 10 Working Group 5, IEEE CEDA and IEEE CASS, which explore the state-of-the-art in the areas ofVery Large Scale Integration(VLSI) andSystem-on-Chip(SoC) design. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase academic as well as industrial research in architectures, circuits, devices, design automation, verification, test, and security, within digital, analog, and mixed-signal systems.
VLSI-SoC 2018 will be held under the theme “Design and engineering of electronics systems based on new computing paradigms” by addressing cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.VLSI-SoC 2018 will be held in Verona, Italy. Verona, which has been awarded World Heritage Site status by UNESCO because of its urban structure and architecture, is the set of the Shakespeare’s Romeo and Juliet play, one of the most visited Roman imperial city in Northern Italy, the capital of the opera lyrics with its Arena roman amphitheater, the land of the Amarone della Valpolicella vineyards.
Conference Theme: “Design and Engineering of Electronics Systems Based on New Computing Paradigms“
初稿截稿日期:2020-05-01
Research topics of interest include, but are not limited to:
TRACK 1: | Analog, mixed-signal, and sensor architectures |
TRACK 2: | Digital architectures: NoC, multi- and many-core, hybrid, and reconfigurable |
TRACK 3: | CAD: Synthesis and analysis |
TRACK 4: | Prototyping, verification, modeling, and simulation |
TRACK 5: | Circuits and systems for signal processing and communications |
TRACK 6: | IoT, embedded and cyberphysical systems: Architecture, design, and software |
TRACK 7: | Low-power and thermal-aware IC design |
TRACK 8: | Emerging technologies and computing paradigms |
TRACK 9: | Variability, reliability, and test |
TRACK 10: | Hardware security |
TRACK 11: | Machine learning for SoC design and for electronic design automation |
GENERAL CHAIRS
Graziano Pravadelli(University of Verona, IT)
Todd Austin(University of Michigan, USA)
PROGRAM CHAIRS
Nicola Bombieri(University of Verona, IT)
Masahiro Fujita(University of Tokyo, JP)
SPECIAL SESSION CHAIRS
Sirnivas Katkoori(University of South Florida, USA)
Katell Morin-Allory(TIMA Laboratory, FR)
PHD FORUM CHAIRS
Kiyoung Choi(Seoul National University, KOR)
Sara Vinco(Politecnico di Torino, IT)
INDUSTRIAL CHAIR
Yervant Zorian(Synopsys, USA)
LOCAL CHAIR
Franco Fummi(University of Verona, IT)
PUBLICITY CHAIRS
Ricardo Reis(UFRGS, BR)
Matteo Sonza Reorda(Politecnico di Torino, IT)
PUBBLICATION CHAIRS
Davide Bertozzi(University of Ferrara, IT)
Mahdi Tala(University of Ferrara, IT)
REGISTRATION CHAIR
Michele Lora(Singapore University of Technology and Design, SGP)
PROGRAM COMMITTEETrack 1: Analog, mixed-signal, and sensor architectures
Piero Malcovati, University of Pavia, Italy(Track Chair)
Tetsuya Iizuka, University of Tokyo, Japan(Track Chair)
Track 2: Digital architectures: NoC, multi- and many-core, hybrid, and reconfigurable
Ian O'Connor, Lyon Institute of Nanotechnology, France(Track Chair)
Michael Huebner, Ruhr-Universitat Bochum, Germany(Track Chair)
Track 3: CAD: Synthesis and analysis
Srinivas Katkoori, University of South Florida, USA(Track Chair)
Ibrahim Elfadel, Masdar Institute, UAE(Track Chair)
Track 4: Prototyping, verification, modeling, and simulation
Tiziana Margaria, Lero, Ireland(Track Chair)
Katell Morin-Allory, Grenoble Intitute of Technology, France(Track Chair)
Track 5: Circuits and systems for signal processing and communications
Fatih Ugurdag, Ozyegin University, Turkey(Track Chair)
Luc Claesen, Hasselt University, Belgium(Track Chair)
Track 6: IoT, embedded and cyberphysical systems: Architecture, design, and software
Zebo Peng, Linkoping University, Sweden(Track Chair)
Donatella Sciuto, Politecnico di Milano, Italy(Track Chair)
Track 7: Low-power and thermal-aware IC design
Dimitrios Soudris, National Technical University of Athens NTUA, Greece(Track Chair)
Alberto Macii, Politecnico di Torino, Italy(Track Chair)
Track 8: Emerging technologies and computing paradigms
Andrea Calimera, Politecnico di Torino, Italy(Track Chair)
Ricardo Reis, UFRGS, Brazil(Track Chair)
Track 9: Variability, reliability, and test
Salvador Mir, University of Grenoble Alpes, France(Track Chair)
Matteo Sonza Reorda, Politecnico di Torino, Italy(Track Chair)
Track 10: Hardware security
Mihalis Maniatakos, New York University Abu Dhabi, UAE(Track Chair)
Lilian Bossuet, University St. Etienne, France(Track Chair)
Track 11: Machine learning for SoC design and for electronic design automation
Mehdi Tahoori, Karlsruhe Institute of Technology, Germany(Track Chair)
Manuel Barragan, TIMA, France(Track Chair)
Abdulkadir Akin, ETHZ, Switzerland
Aida Todri-Sanial, LIRMM, France
Alberto Bosio, LIRMM, France
Alberto Gola, AMS, Italy
Andrea Acquaviva, Politecnico di Torino, Italy
Anupam Chattopadhyay, Nanyang Technological University, Singapore
Arun Kanuparthi, Intel, USA
Bei Yu, University of Texas at Austin, USA
Brice Colombier, CEA, France
Carlos Silva Cardenas, Pontificia Universidad Catolica del Peru, Peru
Cecile Braunstein, PMC/LIP6, France
Chengmo Yang, University of Delaware, USA
Chun-Jen Tsai, National Chiao Tung University, Taiwan
Diana Goehringer, TU Dresden, Germany
Diego Barrettino, Ecole Polytechnique Federale de Lausanne, France
Donghwa Shin, Yeungnam University, Korea
Edoardo Bonizzoni, University of Pavia, Italy
Elena Ioana Vatajelu, IMAG, France
Federico Tramarin, CNR-IEIIT, Italy
Franck Courbon, University of Cambridge, UK
Fynn Schwiegelshohn, Ruhr University Bochum, Germany
Georg Sigl, TU Munich, Germany
Gildas Leger, Instituto de Microelectronica de Sevilla IMSE-CNM-CSIC, Spain
Giorgio Di Natale, LIRMM, France
Haluk Konuk, Broadcom, USA
Haris Javaid, Xilinx, Australia
Houman Homayoun, George Mason University, USA
Ippei Akita, Toyohashi University of Technology, Japan
Iraklis Anagnostopoulos, National Technical University of Athens, Greece
Jaan Raik, Tallin University, Estonia
Jones Yudi Mori, University of Brasilia, Brasil
Jinmyoung Kim, Samsung Advaced Institute of Technology, South Korea
Johanna Sepulveda, Technical University of Munich, Germany
Jose Monteiro, INESC-ID, IST Ulisboa, Portugal
Ke Huang, San Diego State University, USA
Kostas Siozios, Aristotle University of Thessaloniki, Greece
Lars Bauer, Karlsruhe Institute of Technology, Germany
Leandro Indrusiak, University Of York, UK
Lionel Torres, LIRMM, France
Luciano Ost, University of Leicester, UK
Maksim Jenihhin, Tallinn University of Technology, Estonia
Maria Michael, University of Cyprus, Cyprus
Massimo Poncino, Politecnico di Torino, Italy
Matthias Sauer, University Freiburg
Mirko Loghi, Università di Udine, Italy
Nadine Azemard, LIRMM / CNRS, France
Nele Mentens, Katholieke Universiteit Leuven, Belgium
Nektarios Georgios Tsoutsos, New York University, USA
Ozgur Tasdizen, ARM, UK
Paolo Amato, Micron, Italy
Patri Sreehari, National Institute of Technology, Warangal, India
Peng Liu, Zhejiang University, China
Per Larsson-Edefors, Chalmers University, Sweden
Philippe Coussy, University De Bretagne, France
Pierre-Emmanuel Gaillardon, University of Utah, USA
Po-Hung Chen, National Chiao Tung University, Taiwan
Raik Brinkmann, OneSpin Solutions, Germany
Rani S. Ghaida, GlobalFoundries, USA
Robert Wille, Johannes Kepler University Linz, Austria
Rouwaida Kanj, American University Of Beirut, Libano
Said Hamdioui, Delf Technical University, The Netherland
Salvatore Pennisi, University of Catania, Italy
Sezer Goren, Yeditepe University, Turkey
Shahar Kvatinsky, Technion - Israel Institute of Technology, Israel
Sicheng Li, HP, USA
Soheil Samii, General Motors, USA
Sri Parameswaran, University of New South Wales, Australia
Tetsuya Hirose, Kobe University, Japan
Theocharis Theocharides, University of Cyprus, Cyprus
Tolga Yalcin, NXP, UK
Valerio Tenace, Politecnico di Torino, Italy
Victor Champac, National Institute or Astrophysics, Optics and Electronics, Mexico
Victor Kravets, IBM, USA
Virendra Singh, Indian Institute of Technology Bombay, India
Vladimir Zolotov, IBM, USA
Wenjing Rao, University of Illinois at Chicago, USA
Yier Jin, University of Florida, USA
- - Manfred Glesner, TU Darmstadt, Germany
- - Matthew Guthaus, UC Santa Cruz, USA
- - Luis Miguel Silveira, INESC ID, Portugal
- - Fatih Ugurdag, Ozyegin University, Turkey
- - Salvador Mir, TIMA, France
- - Ricardo Reis, UFRGS, Brazil
- - Chi-Ying Tsui, HKUST, Hong Kong, China
- - Ian O'Connor, INL, France
- - Masahiro Fujita, The University of Tokyo, Japan
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介绍:IEEE Council on Electronic Design Automation于2020年10月5日举办2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)。
主办方:IEEE Circuits and Systems Society介绍:IEEE Circuits and Systems Society于2020年10月5日举办2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)。
主办方:IFIP WG10.5介绍:IFIP WG10.5于2020年10月5日举办2020 IFIP/IEEE 28th International Conference on Very Large Scale Integration (VLSI-SOC)。
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