2017年第三届薄膜技术与应用国际会议(TFTA2017)
时间:2017-01-03 08:00 至 2017-01-05 18:00
地点:曼谷
- 参会报名
- 会议通知
- 会议日程
- 会议嘉宾
- 参会门票
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2017年第三届薄膜技术与应用国际会议(TFTA2017) 已过期会议时间:2017-01-03 08:00至 2017-01-05 18:00结束 会议地点: 曼谷 详细地址会前通知 会议规模:暂无 主办单位: Engineering Information Institute(工程信息研究院)
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会议通知
大会内容 主办方介绍
2017年第三届薄膜技术与应用国际会议(TFTA2017)宣传图
The 3rd Int'l Conference on Surface and Interface of Materials (SIM 2017) will be held in Bangkok, Thailand during January 3-5, 2017. SIM is an annual regular conference since 2015 and has been successfully held in Shanghai, China and Bangkok, Thailand. SIM 2017 will be a valuable and important platform for inspiring Int’l and interdisciplinary exchange at the forefront of Surface and Interface of Materials.
SIM 2017 will be co-located with the following conferences:
The 2nd Int'l Conference on Biomaterials and Applications (ICBA 2017)
The 3rd Int'l Conference on Polymer Materials Science (PMS 2017)
The 6th Conference on Nanomaterials (CN 2017)
The 3rd Int'l Conference on Advanced Composite Materials (ACM 2017)
The 3rd Int'l Conference on Thin Film Technology and Applications (TFTA 2017)
The aim of SIM 2017 is to provide a stage for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Surface and Interface of Materials.
On behalf of Engineering Information Institute, we cordially invite you to participate in SIM 2017 and look forward to seeing you in Bangkok, during January 3-5, 2017. Bangkok, the city once known as Siam, remarkably known to be exotic and rich in culture, is the cultural, economic and political capital of Thailand. The city features both old-world charm and modern convenience. Amidst the gleaming skyscrapers of Bangkok, one would still see traditional architectures such as temples, illustrating the retention of its identity whilst being a cosmopolitan city.
We look forward to seeing you in Bangkok during January 3-5, 2017. SIM 2017 will be a complete success due to your keen interests in the Surface and Interface of Materials.
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工程信息研究院,是一个国际学术机构,收集与发布最新的国际学术会议信息,促进学术交流和国际合作,每年与美国电气和电子工程师协会(IEEE)、汤姆逊公司(Thomson)、科学信息研究所(ISI)和美国科研出版社(SRP)等多家知名机构以及全球知名大学和科研机构合作举办国际学术会议。
会议日程 (最终日程以会议现场为准)
Detailed program will be released in December. The provisional schedule is provided as follows:
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January 3 |
January 4 |
January 5 |
8:30-10:00 |
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Invited Speech Session |
Technical Session |
10:00-10:20 |
Coffee Break |
Coffee Break |
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10:20-12:00 |
Invited Speech Session |
Technical Session |
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14:00-16:00 |
Registration |
Invited Speech Session |
Technical Session |
16:00-16:20 |
Coffee Break |
Coffee Break |
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16:20-18:00 |
Invited Speech Session |
Technical Session |
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会议嘉宾 (最终出席嘉宾以会议现场为准)
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参会门票
会议门票
Only Registration Fee(No Oral Presentation)
Item | Before January 3, 2017 |
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Attendee | USD390/RMB2360 |
Registration Fee Includes:
1.Conference Materials(Including one Name Card,one hard copy of the Conference Guide and one hard copy of the Conference Proceeding)
2.All Technical Sessions during the whole conference
3.Lunch Buffet during the conference(January 4,5)
4.Dinner Buffet during the conference(January 4)
5.Coffee Break
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