第六届凝聚态与材料物理国际研讨会（The 6th Int'l Conference on Condensed Matter and Materials Physics）将于2019年8月20-22日在中国西安举行。本届大会囊括凝聚态与材料物理相关领域所有相关议题。

CMMP 2019旨在为业内专家学者分享技术进步和业务经验，聚焦凝聚态与材料物理相关领域的前沿研究，提供一个交流的平台。会议将集聚来自世界各地的科研人员、工程师、学者及业界专家，展示他们在凝聚态与材料物理相关领域的最新研究成果及活动进展。我们诚邀您同聚西安，共襄盛会。 

温馨提示 大会官方语言是英语，没有同声传译

会议议题

第六届凝聚态与材料物理国际研讨会（The 6th Int'l Conference on Condensed Matter and Materials Physics）将于2019年8月20-22日在中国西安举行。本次大会旨在为业内专家学者分享技术进步和业务经验，聚焦催化领域的前沿研究，提供一个交流的平台。 

该会议征文涉及领域包括（但不限于）:

Brittle fracture
Computational physics of material
Computer Simulation in Soft Matter
Crystal Physics
Deformation experiments
Dielectrics
Electronic Structure & Phonons
Energy Materials
Functional Phase Transition Physics
Graphene and carbon physics
Hardening mechanisms
Intermetallic Alloys and their Surfaces: Structure, Properties and Applications
Liquid Crystals
Liquids and Complex Fluids
Liquids, Glasses & Amorphous Systems
Local Structures of Functional Materials
Low temperature physics
Magnetism and spintronics
Materials for energy
Materials physics
Matter under Extreme Conditions
Metamaterials
Metamaterials, photonics and plasmonic
Microscopic processes of plastic deformation
Nanomagnetism 
Nano-materials
Nanoscale physics and technology
Nanoscale Physics at Low Temperatures
Neutron Spectroscopy
Nonlinear Dynamics Complexity and Synchronization
Novel Materials
Phase Transitions
Polymer Physics
Quantum Fluids and Solids
Quantum Gases
Quantum Interfaces
Semiconductor physics and devices
Soft condensed matter and biophysics
Solid State Physics
Statistical physics
Strongly correlated systems
Structural Studies of Nanomaterial
Structure physics
Surfaces, Interfaces and Thin Films
Theory of condensed matter

参会价格

参会费包含内容：
1. 可参加所有会场
2. 会议期间午餐（8月21,22日）
3. 会议期间晚餐（8月21日晚）
4. 会议期间茶歇
5. 会议指南及会议期刊各一本